On Wednesday 10th of May Moortec Semiconductor exhibited at the ChipEx 2017 Technical Conference and Vendors’ Exhibition which took place at the at the Israel Trade Fairs Center in Tel Aviv.
Moortec Marketing Manager, Ramsay Allen was at the event to talk to delegates about Moortec’s market-leading embedded monitoring IP subsystems for today’s technologies. Moortec specialise in high accuracy, highly featured embedded Process, Voltage and Temperature (PVT) sensors. Moortec’s IP enables SoC designs to be performance optimised and monitored on a per die basis and offers support for AVS/DVFS.
If you are working on advanced node technologies it is highly likely that your SoC will require monitoring to enhance real-time performance optimisation and lifetime reliability. Understanding how the chip has been made (process) as well as understanding its dynamic conditions (voltage supply and junction temperature) has become a critical requirement for advanced node semiconductor design.
ChipEx is the largest international event of the Israeli microelectronics industry. ChipEx is held annually in Tel Aviv, Israel and brings together more than 1,500 industry professionals for their annual gathering. ChipEx includes vendors’ exhibition, technology conference and the most exclusive event called the Israel Executive Summit which is specifically designed for the senior executives of the microelectronics industry.
Moortec also attended the ChipEx Executive Summit which took place in the evening of Tuesday 9th at the Tel Aviv Hilton Hotel. Speakers included Mr Russell Ellwanger, Chief Executive Officer of TowerJazz and Mr Axel Fischer, VP/GM of SLSI Division, Samsung Semiconductor Europe and also featured a panel session on Automotive and other Key Drivers of the Microelectronics Industry. The evening concluded with a VIP Cocktail Dinner and networking event.
Established in 2005 Moortec provides compelling embedded subsystem IP solutions for Process, Voltage & Temperature (PVT) monitoring, targeting advanced node CMOS technologies from 40nm, 28nm FinFET and below. Moortec’s in-chip sensing solutions support the semiconductor design community’s demands for increased device reliability and enhanced performance optimization, enabling schemes such as DVFS, AVS and power management control systems. Moortec provides excellent support for IP application, integration and device test during production.
For more information please visit www.moortec.com