The second of a 3 part series of articles by Brian Bailey, Technology Editor/EDA for Semiconductor Engineering.

Optimization Challenges For 10nm And 7nm (Part 2)

“Experts at the Table, Part 2: Heat is becoming a serious issue as thermal densities rise and this creates problems for industries such as automotive that require robust, long-lived components.”

“Optimization used to be a simple timing against area tradeoff but not anymore. As we go to each new node, the tradeoffs become more complicated involving additional aspects of the design that used to be dealt with in isolation.

Read the full article:

https://semiengineering.com/optimization-challenges-for-10nm-and-7nm-2/

For more information about Moortec visit: www.moortec.com

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