Interesting article by Ed Sperling, editor in chief at Semiconductor Engineering.

https://semiengineering.com/

Thermal Damage To Chips Widens

“Heat issues resurface at advanced nodes, raising questions about how well semiconductors will perform over time for a variety of applications.”

Read the full article:

https://semiengineering.com/thermal-damage-to-chips-widens/

For more information about Moortec and how our Temperature Sensor IP can address heat issues on 28nm and FinFET visit: www.moortec.com

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