Interesting article by Ed Sperling, editor in chief at Semiconductor Engineering.
Thermal Damage To Chips Widens
“Heat issues resurface at advanced nodes, raising questions about how well semiconductors will perform over time for a variety of applications.”
Read the full article:
For more information about Moortec and how our Temperature Sensor IP can address heat issues on 28nm and FinFET visit: www.moortec.com