Moortec
Semiconductor Limited, provider of analog and mixed-signal IP solutions,
announces its new High Accuracy Embedded Temperature Sensor targeting UMC’s
advanced node 28nm HPC CMOS technology. This latest addition to the temperature
sensor range extends Moortec’s position as the leading provider of embedded
thermal sensors and on-chip monitoring IP to semiconductor customers worldwide.
The new UMC 28nm HPC Embedded Temperature Sensor is a high precision low power
junction temperature sensor that has been developed to be embedded into ASIC
designs.

On-chip Process,
Voltage and Temperature (PVT) monitoring is becoming a key consideration for 40-nanometer
(nm), 28-nm and FinFET technology-based designs. Higher accuracy monitors embedded within System on Chip (SoC)
designs enable a greater opportunity for dynamic performance optimization,
either for lower power or higher data throughput.  Sensing die temperature, detecting logic speed
and monitoring voltage supply levels can be used intelligently to vary system
clock frequencies and the voltage levels of supply domains. A benefit of
embedded thermal monitoring in particular is to enhance device reliability and
life-time by assessing the electro migration effects of hot spots within the
chip.

Moortec have extended their IP offering within the embedded monitoring space by providing PVT control subsystems, extra digital interfacing options (eg. AMBA APB) and Dynamic Voltage Frequency Scaling (DVFS) sub-systems.

Moortec Semiconductor Limited, provider of analog and mixed-signal IP solutions, announces its new High Accuracy Embedded Temperature Sensor targeting UMC’s advanced node 28nm HPC CMOS technology. This latest addition to the temperature sensor range extends Moortec’s position as the leading provider of embedded thermal sensors and on-chip monitoring IP to semiconductor customers worldwide. The new UMC 28nm HPC Embedded Temperature Sensor is a high precision low power junction temperature sensor that has been developed to be embedded into ASIC designs.

A key aspect is
that PVT data collection can be applied to each and every device, either during
production or ‘in-the-field’. Moortec believe that strategies adopted by IC
designers over the coming years will be heavily influenced through the analysis
of such data harvested from in-chip monitors during the life time of every
device.

“There is
now a critical need for reliable and accurate on-chip thermal monitoring for
semiconductor geometries of 28nm and below”, said Managing Director Stephen
Crosher. “Embedded PVT monitoring is an emerging market and we are pleased to
be supporting UMC’s customers with our innovative thermal sensing circuit technology.”

Moortec have
extended their IP offering within the embedded monitoring space by providing
PVT control subsystems, extra digital interfacing options (eg. AMBA APB) and Dynamic
Voltage Frequency Scaling (DVFS) sub-systems.

PDF version of the Press Release

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