Tag: Subsystem

MicroBT employs Moortec’s 16nm Embedded Temperature Sensor in their HPC ASIC

Plymouth, UK, 28th November 2018 Moortec, providers of complete In-Chip Monitoring PVT Subsystems today announced that Shenzhen MicroBT Electronics Technology Co., Ltd. have employed Moortec’s…

Moortec shortlisted as finalists for two Elektra Awards

Moortec are proud to announce that they have been shortlisted as finalists for two Elektra Awards: Semiconductor Product of the Year – Analogue Moortec have…

Moortec to exhibit at the TSMC Europe Open Innovation Platform® Ecosystem Forum & Technology Symposium

Moortec will be exhibiting their market leading In-Chip Monitoring Subsystem IP at the TSMC Europe Open Innovation Platform® Ecosystem Forum & Technology Symposium which are…

Moortec Supporting Today’s Connectivity Boom with IoT Specific Embedded In-Chip Monitoring Subsystem Solution

Design Automation Conference (DAC), San Francisco, 25th June 2018 Moortec, the in-chip sensing solutions provider, are pleased to announce today at the 2018 Design Automation…

Moortec will be exhibiting their in-chip monitoring subsystem IP at DAC 2018 in San Francisco

Plymouth, UK, 18th June 2018 Moortec Semiconductor will be exhibiting their in-chip monitoring subsystem IP at the 2018 Design Automation Conference which is taking place…