Archives: Blogs

Talking Sense With Moortec – The Future of Embedded Monitoring Part 2

By Stephen Crosher, CEO of Moortec By 2030 it is predicted that transistors will be a sixth smaller The rate of product development is facing…

Talking Sense With Moortec – The Future of Embedded Monitoring Part 1

By Stephen Crosher, CEO of Moortec Shall I compare thee to a…Rolls Royce jet engine? ‘There is a new era dawning whereby deeply embedded sensing…

Talking Sense with Moortec – Verification Pilgrims

A Historical Case for DFT – or how the verification Pilgrims didn’t do their jobs The Mayflower Steps, where the Pilgrims are believed to have…

Less Margin, More Respins, And New Markets.

Ed Sperling from Semi Engineering sat down to discuss the impact of multi-physics and new market applications on chip design with John Lee, general manager…

Monitoring Heat on AI Chips – How to reduce margin and improve performance on very large devices

In this blog Moortec CEO, Stephen Crosher talks about monitoring temperature differences on-chip in AI chips and how to make the most of the power…

In-Chip Monitoring Becoming Essential Below 10nm

Another interesting article from Ann Steffora Mutschler, Executive Editor at Semiconductor Engineering entitled “In-Chip Monitoring Becoming Essential Below 10nm”. The article looks at the importance…

Data Centers and AI Chips Benefit from Embedded In-Chip Monitoring

Daniel Payne has written a blog on SemiWiki summarising the recent Moortec Webinar – The Benefits of Embedded In-Chip Monitoring in Advanced Node Data Center…

Thermal Guard-banding in terms of the accuracy of embedded in-chip temperature sensors

This blog looks at Thermal Guard-banding in terms of the accuracy of embedded in-chip temperature sensors for advanced node CMOS technologies from 40nm down to…

Making AI Silicon Smart with PVT Monitoring

Tom Simon recently wrote an interesting blog article on SemiWiki entitled Making AI Silicon Smart with PVT Monitoring PVT – depending on what field you…

Why Chips Die – Semiconductor Engineering Article by Brian Bailey

Another interesting article by Brian Bailey, Technology Editor/EDA for Semiconductor Engineering entitled “Why Chips Die”. The article examines the many hazards semiconductor devices face that…