Consumer electronics such as mobile technology is typically still found on the planar process technologies and although known for its high performance and low power consumption can still be affected by issues bought about by gate density and have suffered from an increase in physical issues such as thermal management, headroom reduction, and process variability.

Gate density is the major contributor to thermal issues, IR drop issues are a result of the interconnect thickness and pitch, i.e. an increase in resistance per um length of interconnect. The result can hotspots or poor performance bought about by IR drops, however by the effective use of embedded in-chip monitoring subsystem these issues can be bought under control and the end result is an increase in performance and reliability of the ASIC design.